Hot Lead Alert: Credo Tech’s AI Interconnect Ramp-Up
Board seat for Brian Kelleher just dropped. Use this trigger to open pipeline at Credo Technology Group. Pitch SerDes & DSP ICs to solve 400G-1.6T link reliability and hit your quota.
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🚀 Battle Card: Credo Technology Group Holding Ltd
Quick trigger:
👤 Decision Maker in the News
- Brian Kelleher, Independent Director · 🔗 LinkedIn
💡 Why It Matters
- Brian’s move signals a ramp-up in high-speed AI interconnect innovation → Source
- Use this Credo Technology Group Holding Ltd sales trigger to open conversations about scaling AI networks
🎯 Core Pain Point
- Optical link reliability in 400G-1.6T AI fabrics
- Power/per-bit constraints as data-center bandwidth climbs
💰 What to Pitch
- Primary: SerDes & DSP IC portfolio → Eliminate link flaps & cut W/BIT
- Expansion: Active Electrical Cables & SerDes Chiplets → Speed deployment & lower TCO
🗺️ Quick Context
- HQ: San Jose, CA
- Employees: ≈ 200
- Rev: ≈ $50 M
- Website: credosemi.com
🤼 Competitive Intel
*Which other vendors you’ll face to win Credo Technology Group Holding Ltd’s business.*
- Broadcom — SerDes & switch silicon
- Unique edge: Deep ASIC integration for enterprise fabrics
- Evaluated by VP Networking for throughput guarantees
- Marvell — High-speed PHYs & DSPs
- Unique edge: Low-latency coherent optics
- Evaluated by Dir. Engineering for power efficiency
- Intel — Optical transceivers & silicon photonics
- Unique edge: Vertical integration from chip to module
- Evaluated by CTO for roadmap alignment
- Cisco — Active cables & optics
- Unique edge: Global support & interoperability
- Evaluated by COO for deployment risk
- NXP — High-speed mixed-signal ICs
- Unique edge: Customizable IP for niche line cards
- Evaluated by Head of HW Design for flexibility
✅ Do-Now Checklist
Connect with Brian Kelleher on LinkedIn (link above)
Craft email + DM referencing this Credo Technology Group Holding Ltd sales trigger
Schedule follow-ups in CRM (Day 3 & Day 10)
Next Step
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🧠 Copy My Prompt for Personalized Cold Outreach
────────────────────────────
✏️ YOUR COMPANY
────────────────────────────
OUR_COMPANY = ❑<your company>❑
OFFER_BRIEF = ❑Eliminate optical link flaps with our SerDes & DSP IC portfolio❑
PROOF_METRIC = ❑≈ TBD❑
CTA_STYLE = ❑quick_call❑
TONE = ❑punchy❑
────────────────────────────
📌 TARGET COMPANY
────────────────────────────
NAME = Brian
COMPANY = Credo Technology Group Holding Ltd
DEPT = Engineering
SIZE = ≈ TBD
BOTTLENECK = optical link reliability at scale
EVENT = board appointment
DETAIL = appointing Brian Kelleher to its Board
PAIN = optical link reliability issues
SRC = http://cts.businesswire.com/ct/CT?id=ftfLlWd9aZbF2NXfwppam3Bd664=&newsLang=en&newsId=20251030191672&div=41152219
SIM_CO = ≈ TBD
WIN_METRIC = ≈ TBD
NEXT_SIZE = ≈ TBD
EMP_EST = ≈ 200
REV_EST = ≈ $50M
────────────────────────
TASK FOR CHATGPT
────────────────────────
Role: “NewsletterForLeads SDR-Assist”.
Validate any ≈ guesses via SRC.
EMAIL (keep breaks):
Subject: ≈ TBD-person Engineering
Brian—noticed your Engineering team is ≈ TBD.
That’s when optical link reliability at scale slows growth.
We helped ≈ TBD fix this with Eliminate optical link flaps with our SerDes & DSP IC portfolio.
Result: ≈ TBD.
Quick call?
PS—next bottleneck hits ≈ TBD.
DM ≤45 words, TONE:
Saw your post about appointing Brian Kelleher to its Board — optical link reliability issues.
Eliminate optical link flaps with our SerDes & DSP IC portfolio. ≈ TBD.
Quick chat?